Halbautomatisches 200-mm-HF-Messsystem für On-Wafer-Messungen bis 250 GHz

- Semi-automated 200 mm probe system for on-wafer measurements - Integrated controlled dry atmosphere to prevent condensation and ice formation during measurements below ambient temperature - System design with a defined interface architecture enabling integration of optional thermal chucks through standardized mechanical, electrical, and software interfaces - Automatic wafer size recognition (150 mm, 200 mm wafers and individual dies down to 5 × 5 mm) - Precision XY stage: minimum travel range 310 × 310 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Precision Z stage: minimum travel range 30 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Theta axis: ±5°, resolution ? 0.0001° - Controlled contact mechanism with repeatability ? 1 µm - Integrated vibration isolation and leveling table - Central operator console for control of all axes and system functions - Integrated keyboard and mouse tray - Power supply: 100-240 V AC, 50/60 Hz