[Seite 1]
| Kind of Document: Order Specification | Date: 2026-08-07 | |
|---|---|---|
| Page 1 of 6 |
| Document Title | Flip-chip-Diebonder |
|---|---|
| Description | Scope of a flip-chip-diebonder |
| Division/Organization | GSI Detector Laboratory |
| Field of Application | Project “FAIR Accelerator and Experiments” |
Document History
| Version | Created, date | Reason for modification |
|---|---|---|
| V001 | Initial version |
Designation of document: This printout is an uncontrolled copy. Order_specification_Diebonder.docx Template: F-FO-QUA-en-OrderSpec-V001
[Seite 2]
| Kind of Document: Order Specification | Date: 2026-08-07 | |
|---|---|---|
| Page 2 of 6 |
Table of Contents
- Purpose and Classification of the Document............................................................ 3
- Abbreviations, Terms and Definitions ...................................................................... 3
- Scope of the Technical System................................................................................ 3 System Overview ............................................................................................. 3 Scope of Delivery ............................................................................................. 3 Spare Parts ...................................................................................................... 4
- System Specification ............................................................................................... 4 Technical Requirements for System Components ............................................ 4 Functional Requirements ................................................................................ 5 System Environment and Constraints .............................................................. 6
- Quality Assurance, Tests and Acceptance ............................................................... 6
- Documentation ........................................................................................................ 6
Designation of document: This printout is an uncontrolled copy. Order_specification_Diebonder.docx Template: F-FO-QUA-en-OrderSpec-V001
[Seite 3]
| Kind of Document: Order Specification | Date: 2026-08-07 | |
|---|---|---|
| Page 3 of 6 |
- Purpose and Classification of the Document
The purchase order 43096 is for a flip-chip bonder, which is necessary for the commissioning of the FAIR detectors at the FAIR Facility. A flip-chip bonder enables the placement of a CMOS sensor chip onto a suitable substrate with micrometer precision. An important example here is the Micro Vertex Detector (MVD) at FAIR CBM. For this system, approximately 1000 MIMOSIS 2.0 pixel chips—each with a pixel matrix featuring a 40 µm pitch—must be carefully removed from a cut wafer and placed on detector stations. This process involves placing and fixing numerous sensor chips onto the surface like tiles, while adhering to the pixel grid. The sensor chips are then electrically bonded to establish contact. This requires a special tool: a flip-chip diebonder.
- Abbreviations, Terms and Definitions
For the purposes of this document, a “component” refers to an object that is applied to and placed on a substrate.
- Scope of the Technical System
System Overview
The scope of the request for proposals covers an R&D Flip-chip Die bonder, a micro-assembly system with high placement accuracy and additional modules that enable various bonding processes, the precise application of adhesive and the picking of sensors and chips from wafers.
Scope of Delivery
The Flip-chip Die bonder should include the following process modules:
▪ Precision die bonding (face up) ▪ Flip chip bonding (face down) ▪ adapted system work table ▪ chip and substrate heating with process gas enclosure ▪ software-controlled bonding force module ▪ ultrasonic bonding module ▪ in-situ-monitoring with video camera ▪ form generator for creating reference elements for face up alignment ▪ tool tip changing module ▪ three different tool tips ▪ tool tip support including heater ▪ dispenser module for paste and liquids ▪ UV-curing module ▪ die-eject module
Designation of document: This printout is an uncontrolled copy. Order_specification_Diebonder.docx Template: F-FO-QUA-en-OrderSpec-V001
[Seite 4]
| Kind of Document: Order Specification | Date: 2026-08-07 | |
|---|---|---|
| Page 4 of 6 |
Spare Parts and service
• Spare parts and service available for at least ten years. • Service response time within 48 h.
- System Specification
Technical Requirements for System Components
| Item | Minimum requirements | Performance feature (detailing the minimum requirements) | ||||
|---|---|---|---|---|---|---|
| Motorized micro-assembly system with high placement accuracy that can be tested and adjusted | Accuracy 3 µm or better | 3 x tolerance range for | ||||
| reproducible placement and | ||||||
| bonding; | ||||||
| more than 30 verifiable | ||||||
| placements in a row at SAT | ||||||
| system work table | Fitting to die bonder | |||||
| Working area (X, Y) | 350 mm x 150 mm | |||||
| Flexibility | supporting a multitude of bonding technologies and in particular retrofitability of formic acid module | Retrofittable for: - Thermocompression - Thermosonic / Ultrasonic - Soldering (AuSn, C4, Indium) - Formic Acid Module - Adhesive technologies Curing (UV, thermal) - Mechanical assembly | ||||
| Component size | 0,05 mm x 0,05 mm bis 100 | |||||
| mm x 100 mm | ||||||
| Bonding force module up to 500 N | Up to 500 N | Tolerance 0,1N for forces up to 10 N, above that 1% of the rated value | ||||
| Ultrasonic module | Up to 40 W | |||||
| Fine adjustment using micrometer screws for the X, Y, and Z and Theta axes (perpendicular to the bonding surface) and microscope assistance | ||||||
| Table rotation | +/- 2° or more | |||||
| Precision alignment of large chips possible | For chips larger than standard field of view | Shifting at least 80 mm |
Designation of document: This printout is an uncontrolled copy. Order_specification_Diebonder.docx Template: F-FO-QUA-en-OrderSpec-V001
[Seite 5]
| Kind of Document: Order Specification | Date: 2026-08-07 | |
|---|---|---|
| Page 5 of 6 |
| In-situ-Process Monitoring | ||||||
|---|---|---|---|---|---|---|
| using a video camera | ||||||
| Form-generator | Ability to create graphic elements as passmarkers in the operating software for Face up alignment | |||||
| Tool tip changing module | The ability to change the tool | |||||
| tip during the process, for | ||||||
| example, to enable the | ||||||
| assembly of multichip | ||||||
| modules | ||||||
| 3 pieces replacable tools for different component sizes for heated processes | For chip sizes: 5mm x 5 mm 10 mm x 10 mm 17,3 mm x 31,2 mm | |||||
| Tooltip-support including | ||||||
| heater | ||||||
| component (Chip)-heating | Controlled heating of the chip via the tool using a predefined temperature profile up to 450° | |||||
| Substrate heating with process gas enclosure | 50 mm x 50 mm, up to 450°C, | |||||
| also integrated into a process | ||||||
| control system designed to | ||||||
| achieve a reproducible | ||||||
| temperature profile | ||||||
| Process gas enclosure | 100 mm x 100 mm | |||||
| Glue-Dispense-unit | Controlled, high-precision | |||||
| dispensing of defined | ||||||
| volumes of paste and liquid | ||||||
| UV-curing-Module | Option to cure UV adhesive while the chip is held in place | |||||
| Die-eject-module to pick chips from wafer | Also suitable for 8“-wafers, | |||||
| chip size from 500 µm x 500 | ||||||
| µm up to 20 mm x 30 mm | ||||||
| Installation, site acceptance test and on site training |
.
Functional Requirements
Micro-assembly system that allows the following processes:
Designation of document: This printout is an uncontrolled copy. Order_specification_Diebonder.docx Template: F-FO-QUA-en-OrderSpec-V001
[Seite 6]
| Kind of Document: Order Specification | Date: 2026-08-07 | |
|---|---|---|
| Page 6 of 6 |
▪ precision die bonding (face up) ▪ flip chip die bonding (face down) ▪ face up alignment with passmarkers ▪ thermocompression bonding ▪ ultrasonic bonding ▪ adhesive bonding ▪ UV-curing ▪ in-situ-monitoring ▪ Chip-picking from wafer placed on frames ▪ Option to retrofit additional modules, especially formic acid module
▪ on site training ▪ on-site customer service available
System Environment and Constraints
• system will be used in the cleanroom. • area load <1,5 t/m²
- Quality Assurance, Tests and Acceptance
Site acceptance test including • testing and operation of the machine, including all modules. • the verification of parallelism and positioning accuracy with more than 30 verifiable placements in a row
- Documentation
Detailed User Manual
Designation of document: This printout is an uncontrolled copy. Order_specification_Diebonder.docx Template: F-FO-QUA-en-OrderSpec-V001