Flip Chip Die Bonder mit Präzisions- und Flip-Chip-Bonding-Modulen
FAIR - Facility for Antiproton and Ion Research in Europe GmbH · Darmstadt, Deutschland · TED
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Zusammenfassung
Die FAIR – Facility for Antiproton and Ion Research in Europe GmbH in Darmstadt beschafft einen Flip Chip Die Bonder, ein Spezialgerät zur präzisen elektrischen Verbindung von Halbleiterschips mit Sensoren mittels Kontaktbumps. Das System muss verschiedene Bonding-Technologien wie Löten, Thermalbonden und leitfähiges Klebstoffbonden unterstützen sowie umfangreiche Prozessmodule wie Präzisions-Diebonden, Flip-Chip-Bonding, Ultraschallbonden und In-situ-Überwachung mit Videokamera bieten. Die Lieferfrist beträgt 60 Tage, Bewertungskriterien sind Preis (40 %), technische Qualität (12 %), Qualitätssicherung (15 %), Lieferzeit und Installation (18 %) sowie Verfügbarkeit von Ersatzteilen und Service (15 %).
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Beschreibung
In flip-chip assembly, a semiconductor chip is electrically connected directly underside to a sensor via contact bumps. This requires a flip-chip die bonder, which places the chips flipped on the sensors with micrometer precision and enables various bonding technologies such as soldering, thermal bonding, and conductive adhesive bonding.
Qualifikation
Please see FAIR Form Suitability: self-declaration of suitability in accordance with Sections 123, 124 GWB as part of the suitability documents submitted by the company! Please see FAIR form Suitability: self-declaration of suitability in accordance with Sections 123, 124 GWB as part of the suitability documents submitted by the company! FAIR reserves the right to make a one-off additional request for documents within a period to be specified in the additional request letter in accordance with § 56 VgV. However, applicants cannot rely on a subsequent request. Ultimately incomplete requests to participate will be excluded (§ 57 Para. 1 No. 2, Para. 3 VgV).
Lose
1 LosThe Flip-chip Die bonder should include the following process modules: - Precision die bonding (face up) - Flip chip bonding (face down) - adapted system work table - chip and substrate heating with process gas enclosure - software-controlled bonding force module - ultrasonic bonding module - in-situ-monitoring with video camera - form generator for creating reference elements for face up alignment - tool tip changing module - three different tool tips - tool tip support including heater - dispenser module for paste and liquids - UV-curing module - die-eject module
Zuschlagskriterien
5 Kriterien- price40%
Price criteria for "Preis-Quotient-Methode"
- quality12%
"Under this award criterion, an assessment is made of the extent to which the bid documents demonstrate that the proposed system fully meets the technical, qualitative, and functional requirements specified in the procurement documents. In particular, it is important to the contracting authority that the bid clearly shows how the proposed solution fully complies with the order specification. A positive evaluation is given, in particular, for a clearly structured, technically precise, and consistent description of the system configuration and quality assurance. Low scores will be awarded to bids whose documentation is incomplete, contains only general or unreliable statements, or fails to describe the technical implementation and acceptance testing in sufficient detail."
- quality15%
"The evaluation focuses on the completeness, traceability, and technical quality of the quality assurance description as well as the technical documentation. The decisive factor is the extent to which the bidder demonstrates that the required quality is ensured, that compliance with the technical requirements is verified through appropriate testing and acceptance procedures, and that the results are documented in a traceable manner. A positive evaluation is given in particular for a clear, complete, and consistent description of the quality assurance measures, the testing and acceptance procedures, and the intended documentation. Bids will receive a lower score if their explanations remain too general, fail to describe essential elements of the testing and documentation concept in sufficient detail, or leave doubts regarding the reliability of the quality assurance and verification process. Evidence of examples of acceptance tests and documentation."
- quality18%
"The assessment focuses on the transparency and plausibility of the quoted delivery time, installation, and training. It is particularly important to the client that the delivery time, installation period, and training period specified by the client be confirmed. Shorter, plausibly presented timeframes (delivery time, installation period, and training period) will be evaluated positively. Longer timeframes (delivery time, installation period, and training period) will receive a correspondingly lower score, down to 0 points. Furthermore, the bidder"s description of the measures to be taken in the event of impending delivery delays will be evaluated."
- quality15%
The evaluation focuses on the availability of spare parts and on site services, preferably for ten years, service response within 48 h. Availability of spare parts longer than 10 years and service response shorter than 48 h will be evaluated positively. Shorter Availability and longer response time will receive a lower score.