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| LEISTUNGSVERZEICHNIS / Tender Specification | 28.09.2026 | |||||||
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| Banf-Nummer/order request no.: | PR1275392 | |||||||
| Anzahl/quantity: | 1 Stück / 1 piece | |||||||
| Gerätesteckbriefnummer/device profile no: | CEA - 03 | |||||||
| Auftragsgegenstand/order subject: | Automated 300 mm Die-to-Wafer thermocompression bonding tool | |||||||
| KURZE BESCHREIBUNG DER LEISTUNG/ BRIEF SERVICE DESCRIPTION: | ||||||||
| An automated die-to-wafer bonding tool enabling the precise population of semiconductor components (dies) onto substrates is to be purchased. The tool should be able to automatically load and handle 300 mm wafers, 300 mm tape frames but also allows the manual loading of waffle pack chip trays and substrates. A wide range of bonding parameters is adjustable facilitating the successful formation of micro-joints at elevated temperatures, e.g. by reflow, and pressure, i.e. thermocompression, for achieving I/O densities around 106/cm2 and beyond. The bonding process can be carried out in ambient atmosphere and by using reactive or inert gases. At least the component's surface should be treatable by plasma to remove oxidation/contamination layers. The typically intended processing route consists of the following steps: 1) Automated Loading and Unloading of desired wafers from 12" Tape Frame FOUP and 12" wafers from Wafer FOUP; 2) Wafer and Tape-Frame ID-Readout; 3) Automated Feeding of Wafers onto chuck and Tape-Frames into bonding unit; 4) Stretching of the tape, pick-up of dies (components) from the tape, optional flip, and 5) Precise bonding of the components onto wafers or dies. The programming and operating must be possible within an appropriate range of options and parameters as required for research and development. Detailed specification of each module can be found below. | ||||||||
| Legende Kriterien/legend criteria | ||||||||
| B | Bewertung: Leistungsverzeichnispositionen, die mit einem B gekennzeichnet sind, dienen der Bewertung einzelner Kriterien. Die maximal erreichbare Punktzahl für das einzelne Kriterium ist in Spalte J aufgelistet. Eine Nichterfüllung oder keine Angaben führen zum sofortigen Ausschluss. Evaluation: The positions of service specification marked with B are used to evaluate individual criteria. The maximum achievable score for each criterion is listed in column J. Non-compliance or no information will result in immediate exclusion. | |||||||
| F | Forderung: Leistungsverzeichnispositionen, die mit einem F gekennzeichnet sind, müssen zwingend erfüllt werden. Das bedeutet für den Bieter, dass im Angebot dazu Angaben zu erstellen sind. Eine Nichterfüllung oder keine Angaben führen zum sofortigen Ausschluss. Requirement: The positions of service specification marked with F must be fulfilled. The information must be provided in the offer. Non-compliance or no information will result in immediate exclusion. | |||||||
| I | Information: Leistungsverzeichnispositionen, die mit einem I gekennzeichnet sind, fließen nicht in die Wertung ein. Diese dienen der Übermittlung von Informationen. Diese Positionen müssen zwingend beachtet werden. Sie führen nicht zum Ausschluss. Information: The positions of service specification marked with I are not included in the evaluation. They are used for the transmission of information, which must be observed and do not result in exclusion. | |||||||
| LV Pos. / TS Pos. | TECHNISCHE BESCHREIBUNG - Hauptpunkt Technical description - main topic | TECHNISCHE BESCHREIBUNG - Beschreibung Technical description - specification | Anforderungen an die jeweiligen Parameter What is needed - parameter | B/F/O/I/N | max. Punktzahl B/O-Kriterien max. total points B / O-criteria | vom Bieter auszufüllen / to be filled by tenderer | Verweis in Bieterdoku ment / Reference in tenderer document | |
| 1.1 | General Specification | The system equiped must meet the following general safety and operation related requirements | The requisite CE certification must be clearly visible on the equipment and the original declaration of conformity must be handed over to customer. | F | ||||
| 1.2 | General Specification | The system equiped must meet the following general safety and operation related requirements | The documentation for the customer should contain the following content in German or English: Operating instructions, explosion protection assessment, specification of the relevant system components, control plan, maintenance plan and alarm plan, Application manuals, Maintenance manuals, technical schematics like geometrical / mechanical drawings, Pneumatic and electric schematics, spare Parts list, hardcopies will be printed on clean room compatible paper | F | ||||
| 1.3 | General Specification | The system must meet the following general safety and operation related requirements | If the system contains a laser, the relevant performance characteristics and their classification in accordance with German law must be included in the documentation for the customer. | F | ||||
| 1.4 | General Specification | The system equiped must meet the following general safety and operation related requirements | There must be adequate protection on the system and all its components so that accidental crushing, tearing or pulling through or into the system is effectively prevented | F | ||||
| 1.5 | General Specification | The system equiped must meet the following general safety and operation related requirements | Hazardous substances in the equipment must be declared and a safety data sheet must be provided for these substances. Regulations on prohibited substances and import restrictions for Germany must be provided. | F | ||||
| 1.6 | General Specification | The system equiped must meet the following general safety and operation related requirements | Possible evaporations / releases of substances during maintenance work must be described in detail within the operating instructions. | F | ||||
| 1.7 | General Specification | The system equiped must meet the following general safety and operation related requirements | ESD protection has to be guaranteed by integration of ionizers at relevant positions. | F | ||||
| 1.8 | General Specification | The system equiped must meet the following general safety and operation related requirements | New safety-related information that comes to the knowledge of the equipment supplier after its delivery must be notified immediately to the customer. | F | ||||
| 1.9 | General Specification | The system equiped must meet the following general safety and operation related requirements | The system should offer 7 years support on original spare parts, after which qualified spare parts are offered, and software support. | F | ||||
| 1.10 | General Specification | The system equiped must meet the following general safety and operation related requirements | All critical metal parts shall be protected against oxidation / corrosion. All aluminum parts shall be hardened and anodized. | F | ||||
| 1.11 | General Specification | The system equiped must meet the following general safety and operation related requirements | The system shall have data logging capabilities to record the machine performance and status (e.g. start time, end time, number of wafer processed, device number used). | F | ||||
| 1.12 | General Specification | The system equiped must meet the following general safety and operation related requirements | The system has an on / off switch to switch manually the tool off. | F | ||||
| 1.13 | General Specification | The system equiped must meet the following general safety and operation related requirements | The machine runs self-diagnosis of its individual units during system initialization when switched on. | F | ||||
| 1.14 | General Specification | The system equiped must meet the following general safety and operation related requirements | The system is equipped with sensors for monitoring the remaining amounts of consumable materials. Based on the sensor signals, the system should stop the operation in case of risks for faulty processing – an according error message should be displayed. | F | ||||
| 1.15 | General Specification | The system equiped must meet the following general safety and operation related requirements | The equipment has programmable / configurable parameters which are accessible to reduce media consumption of purge materials, which are used in idle mode. | F | ||||
| 1.16 | General Specification | The system equiped must meet the following general safety and operation related requirements | At least the bonding unit/chamber is equipped with a filter fan unit enabling ISO 5 cleanliness or better. | F | ||||
| 1.17 | General Specification | The system equiped must meet the following general safety and operation related requirements | The equipment must have a three coloured signal light tower (Red, Yellow and Green) and support the colour and audio codes as specified below • Light tower signal for: Machine went automatically into stop due to fault (Red blinking) • Light tower signal for: Machine was stopped by operator intervention (Red) • Light tower signal for: Warning message but still running (Yellow) • Light tower signal for: Machine running (Green) • Light tower signal for: Machine is idle and set into standby (Off) • Audio Code: Machine went automatically into stop due to fault (On) • Audio Code: Machine was stopped by operator intervention (Off) • Audio Code: Warning message but still running (Off) • Audio Code: Machine running (Off) • Audio Code: Machine is idle and set into standby (Off) | F | ||||
| 1.18 | General Specification | The system equiped must meet the following general safety and operation related requirements | Environmental conditions in which the system is installed • Clean room class ISO6, raised floor (acc. to DIN EN ISO 14644) • Room temperature 21°C +/-1°C • Humidity (rel.) 45% +/- 5% • Noise generation ≤ 75dB • Max. height x width x length for machine bring in: 350 cm x 300 cm x 500 cm • Raised floor area load: 2500 kg/m² (500 kg point load) • The machine should be able to be set into standby (or shut down) with no N2, vacuum, CDA, and cooling water supplies without damaging the machine. | F | ||||
| 1.19 | General Specification | Material specification | Wafer bulk material: silicon or glass or stack of silicon / glass wafer coupon as substrate ≤ 300mm | F | ||||
| 1.20 | General Specification | Substrate material specification | Standard wafer diameter: 300 ± 0.5 mm or 200 ± 0.5 mm | F | ||||
| 1.21 | General Specification | Substrate material specification | Si wafer thickness range 500 µm - 900 µm | F | ||||
| 1.22 | General Specification | Substrate material specification | Glass wafer standard thickness range 500 µm - 1200 µm | F | ||||
| 1.23 | General Specification | Substrate material specification | Wafer stack (Si + Si or Si + glass) with total thickness up to 2000 µm | F | ||||
| 1.24 | General Specification | Substrate material specification | Wafer warpage and bow up to 2000 µm (300 mm diameter, thickness 775 µm) | F | ||||
| 1.26 | General Specification | Substrate material specification | Minimum workable substrate size 15 mm x 15 mm or smaller. | F | ||||
| 1.27 | General Specification | Component material specification | Tape frame for 200 mm & 300 mm wafer, frame size width 380 mm x 380 mm, outer diameter 400 mm, diced wafers with thicknesses down to 30 µm and up to 1.1 mm. | F | ||||
| 1.28 | General Specification | Component material specification | Minimum workable die size is 1 mm x 1 mm or smaller. | F | ||||
| 1.29 | General Specification | Component material specification | The maximum workable die size is 30 mm x 30 mm or larger. | F | ||||
| 1.30 | General Specification | Component material specification | The minimum workable die thickness is 0.03 mm or thinner. | F | ||||
| 1.31 | General Specification | Component material specification | The maximum workable die thickness is at least 1.1 mm. | F | ||||
| 1.32 | General Specification | Component material specification | 2"x2" and 4"x4" waffle pack chip trays on tape frame compatible plate. | F | ||||
| 2.1 | Detailed System Specification | Computer Hardware/Software | The equipment should be operated via an easy-to-use and easy-to-understand graphical user interface (GUI) from a local PC with the equipment software via flat screen, keyboard and pointing device. | F | ||||
| 2.2 | Detailed System Specification | Computer and Software / MES compatibility | The tool’s computer features local data storage, USB- and Ethernet ports for data transfer. All data required for the tool’s operation and the data recorded during operation can be saved locally. There is an internal data backup. | F | ||||
| 2.3 | Detailed System Specification | Computer and Software / MES compatibility | LAN connection for remote connection and diagnostics, Remote access via secure network connection for fast service support. | F | ||||
| 2.4 | Detailed System Specification | Computer Hardware/Software | Data backup on external USB-drive is possible. | F | ||||
| 2.5 | Detailed System Specification | Computer Hardware/Software | The process software allows the definition of different process steps in a process recipe. All key process parameters must be changeable via the recipe. | F | ||||
| 2.6 | Detailed System Specification | Computer Hardware/Software | The access to the GUI should be protected by at least 3 password / user levels. All password / user levels must be handed over to Fraunhofer (Software Levels e.g. Operator, Engineer, Maintenance , Service supervisor) | F | ||||
| 2.7 | Detailed System Specification | Computer Hardware/Software | Operation mode: This mode should enable automated processing based on predefined system settings and process recipes. Intervention by the operator should be possible for non-critical events. This mode must not offer the possibility to mishandle the wafer processing based on the written recipes. | F | ||||
| 2.8 | Detailed System Specification | Computer Hardware/Software | Engineering mode (or comparable): This mode is used to write process flows and process recipes. If a risk arises during the creation of critical wafer paths or recipes, this should be indicated during recipe creation. A step-by-step instruction for checking recipes is necessary. | F | ||||
| 2.9 | Detailed System Specification | Computer Hardware/Software | Maintenance mode: In this mode, all handling sequences, process recipes and system settings are accessible. Manual axis movements and switching of valves should be possible. Software warnings are necessary to indicate risks of danger to the system, wafers or people | F | ||||
| 2.10 | Detailed System Specification | Computer Hardware/Software | Service supervisor mode: All system settings are accessible. Manual axis movements and switching of valves should be possible. Software warnings are necessary to indicate risks of danger to the system, wafers or people. Risky operations can be operated manually. | F | ||||
| 2.11 | Detailed System Specification | Computer Hardware/Software | System should be able to create a backup of the operating system, the system settings, the process recipes and log files. | F | ||||
| 2.12 | Detailed System Specification | Computer Hardware/Software | Error messages are saved in a log file for documentation purposes. | F | ||||
| 2.13 | Detailed System Specification | Automated Material Handling | EFEM with at least 2 loadports: 1 for FOUPs (25 slots), 1 for tape frame FOUPs (13 slots). | F | ||||
| 2.14 | Detailed System Specification | Automated Material Handling | Ability to distinguish between 300mm FOUP and 300mm FOUP with 200mm insert (info pad coded) | F | ||||
| 2.15 | Detailed System Specification | Automated Material Handling | Automated handling of 200 mm and 300 mm wafers from and into FOUPs in customizable order. | F | ||||
| 2.16 | Detailed System Specification | Automated Material Handling | Readout of wafer ID on top and bottom side (SEMI std. compatible) and Pre-Alignment | F | ||||
| 2.17 | Detailed System Specification | Automated Material Handling | Automated handling of 12" tape frames from tape frame FOUPs in customizable order | F | ||||
| 2.18 | Detailed System Specification | Automated Material Handling | Readout of tape-frame ID on top side and pre-alignment | F | ||||
| 2.19 | Detailed System Specification | Manual material loading | The bonding unit allows manual loading and unloading of substrates. | F | ||||
| 2.20 | Detailed System Specification | Component pick-up | There is a customizable ejector tool base for die picking from the tape frame. | F | ||||
| 2.21 | Detailed System Specification | Component pick-up | Configurable tape-stretching of tape frame of at least 5 mm. | F | ||||
| 2.22 | Detailed System Specification | Component pick-up | Die picking fom 2"x2" and 4"x4" waffle pack chip trays is possible. | F | ||||
| 2.23 | Detailed System Specification | Component flip | The flipping unit allows customizable handover of dies between pick-up head and bonding head. | F | ||||
| 2.24 | Detailed System Specification | Component plasma treatment | Appropriate plasma treatment of die surface by Ar or Ar/H2 to remove contamination and oxide layers after pick-up and flipping. | F | ||||
| 2.25 | Detailed System Specification | Bonding Chuck | The substrate is fixed onto a vacuum chuck. The co-planarity is below 20 µm over the chuck area or better and below 2 µm over an area of 20 mm x 20 mm or better. | B | 20 | |||
| 2.26 | Detailed System Specification | Bonding Chuck | Programmable heating to at least 250 °C for maximum substrate size. | F | ||||
| 2.27 | Detailed System Specification | Bonding Chuck | Temperature uniformity and control are within ±5 K or better. | B | 5 | |||
| 2.28 | Detailed System Specification | Bonding head | Programmable bonding force is at least in the range from 1 N to 500 N. | F | ||||
| 2.29 | Detailed System Specification | Bonding head | Bond force control (3 sigma) should be ± 5% or better for any force greater than 5 N. | B | 10 | |||
| 2.30 | Detailed System Specification | Bonding head | The bonding head is rotatable at least ±1°. | F | ||||
| 2.31 | Detailed System Specification | Bonding head | The total packaged height of substrate and assembled dies is at least 2.1 mm. | F | ||||
| 2.32 | Detailed System Specification | Bonding head | Calibration procedure for optimum tool head to chuck co-planarity. | F | ||||
| 2.33 | Detailed System Specification | Bonding head | Programmable tool head heating to at least 400 °C. | F | ||||
| 2.34 | Detailed System Specification | Bonding head | Temperature uniformity and control are within ±5 K or better for any workable die size. | B | 5 | |||
| 2.35 | Detailed System Specification | Bonding head | Programmable tool head heating rate above 100 °C is at least 100 K/s for any workable die size. | B | 5 | |||
| 2.36 | Detailed System Specification | Bonding head | Programmable tool head cooling rate above 100 °C is at least 50 K/s for any workable die size. | B | 5 | |||
| 2.37 | Detailed System Specification | Bonding atmosphere | Bonding process in inert atmosphere (oxygen content < 100 ppm) is applicable for all workable die and substrate sizes. | F | ||||
| 2.38 | Detailed System Specification | Flux application | Flux dipping of die pillar bumps, applicable for total pillar bump heights of 20 µm, 10 µm and 6 µm. | F | ||||
| 2.39 | Detailed System Specification | Wafer Maps | Loading of wafer maps (e.g. for KGDs, as per manufacturer compatible platfom e.g. or E142) is available. | F | ||||
| 2.40 | Detailed System Specification | Pattern/Fiducial Recognition | Cognex-based or equivalent system | F | ||||
| 2.41 | Detailed System Specification | Tool alignment Accuracy | Tool alignment accuracy is better than ± 500 nm @ 3 sigma for any bonding position | B | 20 | |||
| 2.42 | Detailed System Specification | Post-bonding overlay accuracy | Post-bonding overlay accuracy is better than ± 1000 nm @ 3 sigma for any bonding position. | B | 30 | |||
| 2.43 | Detailed System Specification | Tracefile storage | Individual tracefiles are stored for each die bonded with relation to its bonding position. | F | ||||
| 2.44 | Detailed System Specification | Throughput | Pick & place throughput of the tool exceeds 500 units per hour. | F | ||||
| 2.45 | Detailed System Specification | Pick-up and bonding head tool kits | Tool kits for succesful picking and bonding using the following die sizes are included: 2 mm x 2 mm, 4 mm x 4 mm, 8mm x 8 mm, 10 mm x 10 mm, 15 mm x 15.8 mm; thickness range for all dies: 50 µm - 775 µm. | F | ||||
| 3.1 | Installation and Acceptance | Acceptance Criteria before dispatch | If the infrastructure requirements changes, the system manufacturer must inform the customer immediately, but no later than 6 weeks before delivery of the system. | F | ||||
| 3.2 | Installation and Acceptance | Acceptance Criteria before dispatch | The pre-shipment inspection is carried out according to the system manufacturer's internal protocol. It is assumed that all process specifications can later be demonstrated to the customer. Process parameter specifications will be proven and can be demonstrated later-on at customer site. All materials regarding necessary equipment for the pre-shipment release need to be provided by supplier. | F | ||||
| 3.3 | Installation and Acceptance | Installation and Support | TheshipmentisinspectedbyauthorisedpersonneluponarrivalatCustomersite.Ifanydamageisfound,theconsignmentisnotunpackedany further and the manufacturer is informed immediately to take further action. | F | ||||
| 3.4 | Installation and Acceptance | Installation and Support | The system installation must be carried out during normal working hours on weekdays between 08:00 and 17:00. Customer will support the manufacturer with a qualified technician or engineer during the installation of the system. | F |
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| 3.5 | Installation and Acceptance | Installation and Support | The system manufacturer shall provide a complete set of operating instructions, electrical and pneumatic circuit diagrams, technical drawings for piping, spare parts catalogues, installation and safety instructions, preventive maintenance measures and troubleshooting measures (including all OEM products) at least electronically (pdf). | F | ||||
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| 3.6 | Installation and Acceptance | Installation and Support | The system manufacturer will provide Customer with a tool set containing all the necessary elementary tools required to carry out routine maintenance work on the system. This tool set must be suitable for cleanrooms acc. minimum ISO6. | F | ||||
| 3.7 | Installation and Acceptance | Installation and Support | In particular, the tool set must be equipped with any special tools required to carry out normal maintenance work. | F | ||||
| 3.8 | Installation and Acceptance | Installation and Support | The system manufacturer's customer service department must have all the necessary certificates to enable it to carry out the service. | F | ||||
| 3.9 | Installation and Acceptance | Installation and Support | In the event of a change in the software or hardware of the system, the manufacturer must ensure that a revised complete version of the aforementioned documentation is provided to the customer. | F | ||||
| 3.10 | Installation and Acceptance | Installation and Support | The system manufacturer is responsible for transport to Customer, unloading and bringing the system into the cleanroom and installing the system in the cleanroom. Costs are part of the quotation. Customer will provide a qualified technician or engineer to assist with planning the work on site. | F | ||||
| 3.11 | Installation and Acceptance | Installation and Support | If there are any sensitive areas on the system as delivered, these must be clearly labelled on the outside of the packaging. In addition, the company responsible for transporting and bringing the system into the clean room should be informed of this before carrying out its work by forklift movements. | F | ||||
| 3.12 | Installation and Acceptance | Installation and Support | The bottom of the equipment must have a ground clearance of at least 50 mm for lifting during unpacking. The mainframe must be rigid and firm enough to be lifted by fork lifters. | F | ||||
| 3.13 | Installation and Acceptance | Installation and Support | The maximum outer dimension of the equipment including of the transport utilities (truck fork lifters) must not exceed H=3.50 m, W=3.0 m, L=5.00m. If the equipment dimensions exceed this specification, then the equipment supplier must make actions to split the equipment into smaller modular parts. | F | ||||
| 3.14 | Installation and Acceptance | Installation and Support | The shipment is inspected by authorised personnel upon arrival at Customer site. If any damage is found, the consignment is not unpacked any further and the manufacturer is informed immediately to take further action. | F | ||||
| 3.15 | Installation and Acceptance | Installation and Support | The bottom of the equipment must have a ground clearance of at least 50 mm for lifting during unpacking. The mainframe must be rigid and firm enough to be lifted by fork lifters. | F | ||||
| 3.16 | Installation and Acceptance | Installation and Support | The equipment supplier will provide training sessions for at least two technicians and one engineer. A certification needs to be achieved at the end of customer staff training. Following detailed items should be part of the training sessions: • Procedures for putting the system into operation • Procedures for safely switching the system to standby mode or switching it off. • Working in manual and automatic mode. • Use of special machine functions. • Parameter setup • Machine setup and machine conversion • Interpretation of error codes and procedures for recommissioning. • Detailed troubleshooting procedures. • Maintenance measures and regular checks. • Access to all software levels must be provided, down to maintenance mode resp. supervisor level • Creation of recipes. • Possible risks for substrates, machines and people during operation, maintenance and servicing work. • Possible risks for wafers, machines and people during operation, maintenance and servicing work. | F | ||||
| 3.17 | Installation and Acceptance | Installation and Support | The equipment supplier must submit the complete documentation of the machine infrastructure and utility requirements to Customer no later than 3 months after submission of the order. Following documents are expected: • Footprint drawings including all doors, dimensions, screens, keyboards etc. • Recommendation for installation locations of the utilities • Facility requirements (power, compressed air, vacuum, DI-water, standard and special gases, chemicals, exhaust conditions etc.) | F | ||||
| 3.18 | Installation and Acceptance | Acceptance criteria at customer site | The system manufacturer must demonstrate at least the following handling and system perfomances: • The Emergency Off (EMO) must be checked. System and all electronics shut down immediately (in case of installed UPS, system PC is still working); System must not restart until EMO gets unlocked. • The safety door interlock must be checked. • Complete process functionality in compliance with specified parameters will be checked with customer material • Complete tool documentation provided | F |